 |
|
| |
|
|
金凸点
适用：Chip-On-Glass (COG), Tape-Automated-Bonding (TAB)
Chip-On-Flex (COF)
尺寸：10 μm x 10 μm min.
高度： 25 μm. max.
硬度：45-60 Hv.
|
 |
|
|
铟凸点
适用：X射线、
红外探测器
Single die bumping for HgCdTe, InSb, GaAs and CdZnTe
尺寸：凸点直径 10 μm min.
高度 12 μm. max.
间距: 8 μm.min.
|
 |
|
|
COPPER UBM:
适用：Under-Bump-Metal (UBM) for Pb/Sn solder bumps.
尺寸：凸点最小直径 10 μm x 10 μm min.
高度 25 μm. max.
凸点间距 10 μm. min.
|
 |
|
|
COPPER POSTS:
Tall copper bumps for improved compliance.
典型尺寸：高度 75 μm
直径 75 μm diameter on a 150 μm pitch.
|
 |
|
| |
|
|
ELECTROLESS NICKEL（化学镀镍）凸点:
As a low-cost UBM for screen-printing of solder bumps.
平均高度5-8 μm with approximately 500 ? of Au.
|
 |
|
|
LEAD-FREE PURE TIN-BUMPS:
Melting point of 232 oC
|
  |
|
|
LEAD-FREE TIN-BISMUTH BUMPS:
成分：80/20 Sn/Bi with a melting point of 185 oC.
|
  |
|
|
LEAD-FREE TIN-COPPER BUMPS:
成分：99.3/0.7 Sn/Cu with a melting point of 227 oC.
|
  |
|
|
LEAD-FREE TIN-SILVER BUMPS:
成分：96.5/3.5 with a melting point of 221 oC
90/10 with a melting point of 310 oC.
|
  |
|
|
LEAD-FREE TIN-SILVER-COPPER BUMPS:
成分： 95.7/3.5/0.8 melting point 217 oC. approximately
|
  |
|
|
